Multilayer PCB Has A lot more Than Two Conductive Copper Layers

Multilayer PCB recieve more than two conductive copper levels which mainly consist of inner level cores, prepreg levels and copper foils and they? re melted together by means of heat and pressure. Lamination process is one of the key to manage good quality of multilayer PCB, this method requires specific heating system and pressure with regard to specific durations dependent on materials used to ensure the PCB board is manufactured properly.

The multilayer PCB is the development of typically the double sided PCB with increasing complexity and density of components, they allowed the designers in order to produce highly intricate and compact circuits and further advancement of blind and buried via hole technology has pressed these limits also further.

With the particular requirements of larger precision in various apps, the demands regarding multilayer PCB keep increasing continuously recently. The typical programs of multilayer imprinted circuit boards consist of Computers, Data safe-keeping, Cell phone transmission, GPS technology, satellite systems and thus on.

A-TECH is an experienced multilayer PCB manufacturer which usually own complete multilayer PCB manufacturing process in house from inner layer, vacuum lamination to area finishes, it gives us more advantages in the competition of global industry shares for multilayer printed circuit boards on quality, price and lead time. Currently the proportion associated with multilayer PCB we all manufactured is more than 65%.

multilayer pcb HDI PCB, the entire brand is Very dense Interconnect PCB, it needs a lot higher wiring density with finer search for and spacing, smaller vias and larger connection pad denseness. Blind and hidden vias? design any of their noticeable feature. HDI PCB are widely utilized for Cellular phone, capsule computer, digital camera, GPS NAVIGATION, LCD module plus other different area.

A-TECH CIRCUITS provides HDI PCB production services to around the world customers in the particular high end automotive business, medical camera industry, mobile, computing in addition to defense industry.

At present the advanced HDI technology we used include: “Direct Laserlight Drill”(DLD) is going of copper layer by direct CARBON DIOXIDE laser irradiation, beat additional laser going with conformal mask, the copper direct laser drilling has the ability to of providing increased accuracy, better opening quality and much better efficiency for HDI projects. “Copper Filled” for special bunch microvia, “Laser Primary Imaging”(LDI) is specifically designed for great line technology, to eliminate dimensional stableness problem of art work caused by environmental and material problems.